M.S.C INDUSTRY

M.S.C INDUSTRY is a high-tech enterprise engaged in R&D, production and sales of semiconductor packaging equipment. The core team are from well-known company in the industry. At present, it has more than 60 patents, of which more than 20 are invention patents. Our company has completed the research and development of IC level 8-inch and 12-inch die bonder, flip FC die bonder, Soft solder die bonder, which has been verified by the industry's major customers. The products under development include high-precision flip chip die bonder and advanced high-precision stack die bonder. Equipment’s machine, electrical, motion control, linear motor, software, vision and other core parts are developed independently , the whole machine accessories localization rate reached more than 95%. At the same time, the company invested in the constant temperature processing assembly inspection workshop, the use of imported precision CNC processing equipment, testing equipment, self-developed core parts, in order to ensure the processing, assembly accuracy and consistency of the company's products. Adhering to the corporate vision of "creating higher value for customers and creating a better future for employees", the company continues to make efforts of high-end semiconductor packaging equipment, and strives for become world-clas brands.

M.S.C INDUSTRY

2015年

  • founder return
  • from board
  • build R&D team
  • position R&D IC-level Die Bounder

2016年

  • devote R&D

2020年

  • 8-inch Die bounder successfully developed
  • passed the equipment verification
  • devote 12-inch Die bounder's R&D



2021年

  • take coustmer orders
  • 12-inch Die bounder successfully developed
  • devote flip chip Die bounder's R&D
  • Completed the first round of financing

2022年

  • passed verification of improtant client
  • increase production capacity to take coustmer orders

2023年

  • Flip Chip Die bounder developed
  • 12-inch softsolder Die bounder developed



2024年

  • devote PVD/CVD equipment R&D
  • devote high-precision stack die bounder's R&D
  • prepare for listing

2025年

  • R&D of high-precision Die bonder
  • 2.5D high-precision stack die bounder's developed

2026年

  • AOI equipment developed
  • 3D stack Die bound developed

CULTURE

TEAM ACTION RESPONSABLE SHARE


CONCEPT

Brand drives value and future


VALUE

People oviented pursue excellence


VISION

Creating value for users


| PRECISION MACHINING

  • Constant temperature precision processing workshop
  • High precision CNC
  • 3-axis/4-axis/5-axis CNC machining center, lathe-mill cutting center, etc.
  • 100% independent processing of precision parts

| QUALITY CONTROL

  • 24-hour constant temperature testing center
  • Hexagon 3D CMM
  • Hexagon 2D CMM
  • High-speed camera and other detection equipment

| ASSEMBLE

  • Constant temperature and dust-free assembly test workshop
  • Professional assembly and commissioning fixture
  • Professional process QC equipment and inspection tools